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Reliability is determined using a variety of methods, usually used in combination. Often an unassembled PCB is exposed to a conditioning or aging environment. The conditioning may consist of time, temperature, humidity, and contamination metrics. The conditioning is normally at a higher level than the environment in which the device is intended to be used so that the test environment imparts an accelerated age condition. Temperature exposure for PCBs is commonly conducted at 155 C for 4 or 8 hours to study shelf-life. To study the effect of soldering, simulation is conducted at the actual reflow temperature, without contact with flux or solder. Temperature cycling of assembled devices reflects the difficulty of the intended end-use environment.Although some cycling may occur at 0 C to 100 C, more severe cycling may require 55 C to 125 C. Assembled parts may also undergo physical testing conditions such as physical shock, vibration, bending, twisting, and impact. Environmental exposure testing is common for PCB surface finish evaluation. Exposure to ambient air during reflow is common, as is long-term exposure to polluting environments such

the result of the operation back into the same register. Figure 4.1 illustrates the source and destination for these types of instructions. The format of the instruction is: Mnemonic Destination Register. Examples of these instructions are as follows. Rd is any register from the register file and is the destination (as well as the source) register for the operation. COM Rd: 1 s complement (invert all the bits) of the register Rd is stored back in register Rd. INC Rd: Increments the contents of Rd by one. DEC Rd: Decrements the contents of Rd by one. TST Rd: Test for zero or negative contents of the Rd register. CLR Rd: Loads $00 into the Rd register. SER Rd: Loads $FF into the Rd register. LSL Rd: Shifts the contents of register Rd one place to left. A 0 is shifted in bit position 0, and the contents of bit7 are copied to the Carry flag. LSR Rd: Shifts the contents of register Rd one place to Right. A 0 is shifted in bit position 7, and the contents of bit0 are copied to the Carry flag. ROL Rd: Rotate Rd register contents left through the carry. Carry flag goes to bit0, and bit7 goes into the carry. ROR Rd: Rotate Rd register contents right through the carry. Carry flag goes to bit7, and bit0 goes into the carry.

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as mixed flowing gas. Physical contact with contaminating materials such as fluxes, assembly materials, fuels, and even diesel fuel and carbonated beverages has been documented. Electrical testing is another class of reliability testing. The function of a solderjoint formed with the surface finish can be measured by burn-in testing, electrical functional tests, and/or high-current-density application for extended periods. The contact resistance of an unassembled surface finish is an important measurement. The PCB finish, when exposed to heat and humidity metrics, as well as environmental exposure, may need to pass a sensitive four-point probe contact resistance check.

32.11.1 High-Speed Signals Electrons travel along the outer regions of a conductor. This phenomenon, known as the skin effect, is most pronounced at the high signal frequencies of Global Positioning Systems (GPS), aerospace, navigation, mobile telephony, computer servers, and crash avoidance devices. At high frequencies, the skin depth of electron travel is of a thickness similar to that of the PCB surface finish. For example, at 10 GHz, the skin depth is less than 1 micron. Therefore, the electrical conductivity of surface finish materials is important at those higher frequencies. Above 2 GHz, circuit designers find that the use of electroless nickel hinders signal integrity. Silver, the most conductive element, is used for devices operating at higher frequencies.

Application factor, Ka [13]

32.11.2 Inspectability To ensure good soldering, it is necessary for the assembler to ensure that all copper is protected and no solder mask residue remains on solderable features. By inspecting the bare board, the engineer can reject parts that show bare copper due to skipped surface finishing or mask residue. A special case is OSP, where inspection of the protected copper is impossible because OSP-protected areas have the same visual appearance of uncoated copper with or without thin solder mask contamination.

32.11.3 Contact Functionality Many circuit board assemblies rely on surface contact functionality to operate. Examples include touchpads, edge contact rails for grounding/shielding, test probe contact points, zero insertion force connectors, chassis and enclosure bolts, and surface contacts for mating with nonsoldered connectors/interposers. OSP does not meet the demands of surface contact, so selective plating or soldered contact designs must be used. Immersion tin may lose contact functionality as the intermetallic oxidizes. HASL will maintain contact ability, but suffers from material creep under load, which may allow loose connections after field use. Silver maintains contact functionality even when tarnished, but loses contact ability if heavily corroded by the environment. ENIG maintains contact functionality over long periods of time, but is also susceptible to excessive corrosion. Electroplated Ni/Au is the best performing finish for long-term contact functionality.

32.11.4 Wirebonding Some device designs call for wirebonding directly to the PCB or laminate chip carrier. In general, most surfaces are wirebondable with aluminum wire. Al wirebonding may be impossible

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