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According to the latest ITRS roadmap, the pitch of area-array packages is expected to decrease to 100 mm by 2009. Simultaneously, the electrical performance of these interconnections needs to be improved to support data rates in excess of 10 Gbps, while guaranteeing thermomechanical reliability and lowering the cost. These requirements are thus challenging, requiring innovative interconnection designs and technologies. To meet these challenges, nano wafer-level packaging that uses nano materials and structures to bring about unprecedented advances in electrical, mechanical, and thermal properties in the chip-to-package interconnections is being investigated.21, 22

Even with good chemical formulation, correct operating conditions, and good inspection, black-pad still occurs in PCB assembly. Certain PCB designs are more vulnerable to blackpad due to galvanic effects set up in the plating bath in areas of extreme anode/cathode ratio. Users should be aware that there is no complete solution to black-pad, but adoption of the following measures is highly recommended:

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Cure the solder mask as much as practical to prevent photoinitiator contamination of the nickel bath. Use a cleaner before the nickel bath capable of removing material from the solder mask that may be leached out in the nickel bath. Operate the nickel bath to result in 9 percent phosphorous or higher. Test the corrosion resistance of the nickel deposit using nitric acid exposure. Use a mild gold bath that delivers a gold thickness target of 0.07 to 0.15 mm. Use function testing such as tape test and XRF to screen for black-pad.

Types of Application Design Life (thousands of hours) 01 05 4 8 8 14 14 20 20 30 50 60 100 200

Dendrites and Electrochemical Migration Metals, when patterned as conductors and placed under electrical bias, can suffer from a vulnerability to electrochemical migration. When exposed to an electrolyte (such as dirty water), PCBs form an electrochemical cell. At the anode, metal is stripped of electrons (ionized) and can dissolve in the electrolyte. The corrosion, movement, and redeposition of metals is termed electrochemical migration, and can form interesting structures such as metal dendrites. All metals are susceptible to dendrite formation. Indeed, dendrites formed from PCB circuitry usually contain copper sourced from the patterned outerlayer copper. Groups such as IPC, Battelle, and Underwriters Laboratories have studied electrochemical migration. Documents issued by these groups show the causes of migration to include surface cleanliness, electrical bias, environmental humidity, and conductor spacing. The selection of surface finish material is not a leading factor in vulnerability to dendritic growth. However, a metal will corrode and migrate more quickly than others depending on the type of contaminating environment. In general, more noble metals such as gold resist corrosion better than copper. This is a main reason for the use of a protective surface finish. Metals such as silver and tin are attacked by sulfur, leading to corrosion. Electroplated

silver, used to some extent in component terminations, does have a higher propensity for dendritic growth. Electroplated silver was abandoned as a PCB finish in the 1960s due to dendritic growth. Immersion silver does not behave in the same way as electrodeposited silver.

These instructions are used to access the I/O space. The I/O registers can only be accessed using these instructions: In Rd, PORTADDRESS; Out PORTADDRESS, Rs. Rd, Rs can be any of the 32 registers from the register file, and the I/O registers can be any register from the entire range of $00 to $3F (a total of 64 I/O registers). Figure 4.3 illustrates how such instructions operate.

Solderjoint Voiding Solderjoint voiding can result from various causes, including flux type, PTH blowholes, poor wettability, the Kirkeldall effect, and improper surface finish deposition. Surface finishes contaminated with organic materials have been shown to exhibit solderjoint voids after assembly. Silver has been connected with the void phenomenon termed microvoids, champagne voids, or planar microvoids. The mechanism for microvoiding has been determined to result from overaggressive silver bath deposition on improperly treated substrate copper. When the silver exchange reaction attacks the copper nonuniformly, a cave can be created in the copper from the localized galvanic attack. The cave entraps flux or moisture, resulting in a series of voids just above the intermetallic layer. If too many voids form at the pad interface, the reliability of solderjoint strength is compromised. Following the chemical suppliers exact operating recommendation resolves this problem. Other types of voids, such as process voids, pinhole voids, and microvia voids, are not caused by the type of surface finish selected, but depend on the PCB design and assembly parameters.

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